The microelectronics industry is increasingly focusing on trend topics such as miniaturization, 3D integration and artificial intelligence (AI). New developments and technologies such as quantum computing will also provide strong impetus for further advances in the medium to long term. With the increased use of mobile devices and the Internet of Things (IoT), energy efficiency is also an important aspect of microelectronics.
Progressive miniaturization on a nanoscale level represents a technological challenge. Ever smaller structures and 2D materials require innovative approaches to overcome current physical limits. Among other things, chips for 5G applications are to be developed that improve connectivity in various application areas – for example, for autonomous vehicles.
The experts at Fraunhofer ILT develop and evaluate beam sources for EUV lithography and the corresponding measurement technology in order to advance the miniaturization of electronics. In addition to generating structures on the nanometer scale, the institute also focuses on assembly and connection technology for high-performance electronic components. Together with industrial partners, Fraunhofer ILT is developing new connection technologies for battery contacting and power components.
Fraunhofer ILT also has expertise in the structuring and functionalization of surfaces and in 3D volume structuring. For example, microscopic structures can be introduced into glass or sapphire substrates by selective laser etching, structures that can be used to create microfluidic systems for biochemical analyses.
Fraunhofer Institute for Laser Technology ILT
